Printed circuit boards (PCBs) link various internal electronic circuits using small electrical networks. In essence, the entire board physically and electrically supports the various electronic elements by applying thin copper tracks or various other components. The printed circuit board’s primary function is to combine the different functional parts of the device and provide a stable interface. While being used in electronic devices, the PCB is also widely used in medical applications. In particular, it is commonly used in electronics, optoelectronics, optically controlled, and integrated circuit design.
Through-hole technology has been the most common method of circuit board assembly for several years now. However, due to the increasing popularity of the through-hole technology, manufacturers have started to explore alternative PCB manufacturing techniques such as roll laminator and magnetic tape based on dielectric and resistive materials. This has led to the increased popularity of various alternative PCBS techniques such as solid top plate, hot pad, liquid metal printed circuit board (LMPC), and magnetized layer on metal lamination.
Hot pad and magnetized lamination are low-cost methods of the printed circuit board assembly. This is because these methods do not require the need for mechanical tools and other expensive equipment for their production. Due to this, they can be easily purchased at a much lower price than the ones used by through-hole technologies. However, although these two are considered low-cost methods, they can still meet the demands of larger-scale companies. Moreover, they are flexible in terms of size, design, and functionality.
Apart from the production of smaller-sized and flexible electronic components, another important role of Printed Circuit Board Assembly is to provide stability for the assembly of larger-sized components such as microprocessors, DIPs, and motherboards.
Moreover, it is essential to place Printed Circuit Boards according to the orientation in which they will be utilized. The most commonly used orientation is vertical, but some electronic components have been developed, which can be mounted in a variety of ways, including horizontal, vertical, and even horizontal and vertical alignment. This is because different components of a product may be placed in different positions. For example, some products may be positioned in an upright position, while others may be mounted on a desktop.
Surface Mount Technology
Due to the need for larger holes and the thicker components produced, a unique option for the assembly of thicker Components is to opt for surface mount technology. Typically, surface mount technologies allow components to be printed on a plastic substrate then mounted to a metallic frame with clamps or tabs.